With this latest portfolio expansion, BOPLA is setting new standards for electronic enclosures. As a distributor, Börsig welcomes the targeted further development of proven product lines—with a clear focus on practical requirements such as thermal management, size, and ease of assembly.
The focus is on the Alubos and BoLink product lines, which have been specifically expanded to offer developers more flexibility in integrating modern electronics.
Optimized Cooling for High-Performance Applications
A new variant has been introduced for the Alubos aluminum profile enclosure series: The ABPH 1680 KWL heat sink solution is specifically designed for the largest size and significantly improves heat dissipation at high power densities.
In addition, integrated wall brackets ensure easy installation—particularly in typical applications where larger enclosures are mounted directly on walls. The combination of thermal optimization and mechanical flexibility simplifies the design process and reduces design compromises.
More Space for Electronics and Interfaces
The BoLink series has also been expanded. Two new, larger base sizes offer additional installation space for electronics and enable the integration of more complex applications.
The new models:
- Larger housing dimensions for enhanced functionality
- Optionally available with integrated wall brackets
- Available in black and white
- Seamless integration into existing production lines
With this expansion, the BoLink series now comprises a total of three basic sizes and covers an even broader range of applications—particularly for compact applications with increasing space requirements.
Practical Further Development
With this expansion, BOPLA is pursuing a clear approach: Proven enclosure series are being specifically further developed to meet current requirements in industry, automation, and electronics design. The focus is on:
- Improved heat dissipation with increasing power density
- Flexible enclosure sizes for various application scenarios
- Practical mounting options
- Customization based on established platforms
The new variants offer clear advantages for developers and designers: greater design freedom, improved thermal performance, and a high degree of adaptability to real-world operating conditions. With these offerings, BOPLA once again underscores its expertise in enclosure technology and delivers solutions that can be efficiently integrated into modern applications.
We’re happy to assist you with any questions or in selecting the right enclosure solution.
If you have any further questions, your contacts from our in-house and field sales teams will be happy to assist you.
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